Greek Minister, State Department Official pitch importance of Fair
WASHINGTON, DC — The American Hellenic Institute (AHI) hosted a panel presentation featuring Greece’s Minister of Digital Policy, Telecommunications and Information Nikos Pappas and Deputy Assistant Secretary of State for the Bureau of European & Eurasian Affairs Jonathan Cohen, February 9, 2018, at the Capital Hilton, Washington, D.C. The panelists spoke about their five-day, five-city U.S. tour in support of the 2018 Thessaloniki International Fair. The United States will be the honored country at the Fair, which will be held September 8-16, 2018. The Fair’s theme is “Harnessing the Power of Innovation and Creativity.”
AHI President Nick Larigakis opened the panel discussion with welcome remarks and moderated the panel discussion. He provided a backdrop about the Fair’s economic and political importance in Greece.
Minister Pappas reviewed their U.S. tour to five cities, which included visits to companies such as: Facebook, Lockheed Martin, Netflix, AirBnb, and Electronic Arts, among others, to recruit investors and exhibitors for the Thessaloniki International Fair. He touted Greece’s incentive plan to attract companies in the audio/visual and film sector. In addition, Minister Pappas showed two video presentations demonstrating Greece’s readiness to attract investment.
Deputy Assistant Secretary Cohen stated the Thessaloniki International Fair will be the most important event in U.S.-Greece relations in 2018, adding that Secretary of Commerce Wilbur Ross will attend. He reflected on his experience at Capital Link Forum in New York City in December as an indication the investment community and Wall Street is bullish about Greece’s future. Cohen added the Fair provides an opportunity to show support for the U.S.-Greece relationship, which is at its best level since World War II.
Both government officials are looking to the Diaspora to create a buzz about the Fair, encouraging businesses and people to support the event via sponsorship or by attending.